BYTON announces new Vice President of Program Management

BYTON announced that it has further reinforced the company’s executive team with the appointment of Andrew Ball to the position of Vice President of Program Management. In this position, he will be responsible for driving the development of BYTON’s product line in order to deliver high-quality vehicles on time.

Within this role, Ball will strengthen the program management processes on a global scale, allowing BYTON to achieve its goals of offering different products, globally, on a single platform, starting with the BYTON M-Byte SUV.

Ball has over 20 years of experience in automotive program management, with most of those years spent at Ford across research and engineering operations in Europe and China. While at Ford, Ball led engineering programs for several key platforms and models delivered across Asia, including the Taurus, Focus, Fiesta, Escort and more. Ball also was key in building global multicultural teams as Ford increased its presence in the flourishing China market.

BYTON CEO Dr. Daniel Kirchert said, “Andrew joins BYTON at exactly the right time, ensuring that the company delivers the premium, smart electric vehicle that has been promised since the global unveil of the M-Byte SUV at CES 2018.”

On May 30, the first M-Byte body in white (BIW) rolled off the brand new BYTON factory weld line. The term “Body in white (BIW) refers to the stage of manufacturing in which the body-components of a car have been joined together. This is the first BIW built with all the design processes that will go into a customer car. The BIW joins nearly 100 M-Byte prototype vehicles being tested to ensure every BYTON meets the most stringent safety and quality standards in China, the US and Europe. Tests currently being conducted include passive safety, powertrain, braking system, NVH (Noise Vibration Harshness), aerodynamics, HVAC (Heating, Ventilation and Air Conditioning) and durability. Forthcoming testing will include active safety, advanced driver assistance systems, high temperature durability, UI/UX and connectivity, among others.